The TIM substantially boosts the rate at which heat can be taken away from active electronic components and channeled into a heatsink for air or water to carry away.
That in turn means a lower demand on active cooling technologies, including fans and liquid cooling.
bet it’s cheaper to just drain aquafirs dry to generate apes tho
No_Quote7705 on
That’s a huge, a 13% cut in cooling demands could save tons of energy and lower costs. Let’s hope this tech gets widely adopted – our planet could use the break.
yonly65 on
Typical data center cooling & electrical overhead is 15%-20%, not the 40% quoted in the article. State of the art is 10%. A more-efficient thermal transfer from chip to cooling medium would allow data centers to run smaller temperature deltas in the cooling system, which would *slightly* improve that efficiency.
jish5 on
Cool, how about gaming laptops? Cause God damn these things laptops run hella hot.
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Summary:
Meeting the world’s data storage demands [is costly](https://www.sciencealert.com/google-pivots-to-nuclear-reactors-to-power-its-artificial-intelligence), in terms of money, energy, and environmental impact – but a new material could significantly improve the cooling of our data centers while also making our home and business electronics more energy efficient.
Currently, bulky and energy-intensive cooling solutions are typically deployed to chill out the hardware holding our data, adding up to [about 40 percent](https://www.energy.gov/articles/doe-announces-40-million-more-efficient-cooling-data-centers) of overall data center energy use (around 8 terawatt-hours every year).
The team from the University of Texas at Austin and Sichuan University in China [estimates](https://cockrell.utexas.edu/news/archive/10078-new-thermal-interface-material-could-cool-down-energy-hungry-data-centers) around 13 percent of those 8 terawatt-hours could be shaved off by their new organic [thermal interface material](https://en.wikipedia.org/wiki/Thermal_interface_material) (TIM).
The TIM substantially boosts the rate at which heat can be taken away from active electronic components and channeled into a heatsink for air or water to carry away.
That in turn means a lower demand on active cooling technologies, including fans and liquid cooling.
Read the peer-reviewed paper: [https://www.nature.com/articles/s41565-024-01793-0](https://www.nature.com/articles/s41565-024-01793-0)
neat
bet it’s cheaper to just drain aquafirs dry to generate apes tho
That’s a huge, a 13% cut in cooling demands could save tons of energy and lower costs. Let’s hope this tech gets widely adopted – our planet could use the break.
Typical data center cooling & electrical overhead is 15%-20%, not the 40% quoted in the article. State of the art is 10%. A more-efficient thermal transfer from chip to cooling medium would allow data centers to run smaller temperature deltas in the cooling system, which would *slightly* improve that efficiency.
Cool, how about gaming laptops? Cause God damn these things laptops run hella hot.