Dieses US-Startup stellt ein wichtiges Chipmaterial her und nimmt es mit einem japanischen Riesen auf

Thintronics is a startup that provides a novel thin, skew-free substrate for printed circuit boards (PCBs).

The company’s primary focus is to help companies create better products through reconceptualizing PCB design, particularly for high-density, ultra-thin devices such as mobile, IoT, wearables, and autonomous systems. 

Thintronics is promising a product purpose-built for the computing demands of the AI era—a suite of new materials that the company claims have higher insulating properties and, if adopted, could mean data centers with faster computing speeds and lower energy costs. 

The company is at the forefront of a coming wave of new US-based companies, spurred by the $280 billion [CHIPS and Science Act](https://www.technologyreview.com/2023/01/09/1064735/us-tech-policy-changing-innovation/), that is seeking to carve out a portion of the semiconductor sector, which has become dominated by just a handful of international players.

But to succeed, Thintronics and its peers will have to overcome a web of challenges—solving technical problems, disrupting long-standing industry relationships, and persuading global semiconductor titans to accommodate new suppliers.

Can it succeed? Or are there too many other companies with competing interests?