Zukünftige Hochleistungsrechnerchips könnten auf Glas gebaut werden

Human-made glass is thousands of years old. But it’s now poised to find its way into the AI chips used in the world’s newest and largest data centers. This year, a South Korean company called Absolics is planning to start commercial production of special glass panels designed to make next-generation computing hardware more powerful and energy efficient. Other companies, including Intel, are also pushing forward in this area. If all goes well, such glass technology could reduce the energy demands of the sorts of high-performance computing chips used in AI data centers—and it could eventually do the same for consumer laptops and mobile devices if production costs fall.

The idea is to use glass as the substrate, or layer, on which multiple silicon chips are connected. This form of “packaging” is an increasingly popular way to build computing hardware, because it lets engineers combine specialized chips designed for specific functions into a single system. But it presents challenges, including the fact that hardworking chips can run so hot they physically warp the substrate they’re built on. This can lead to misaligned components and may reduce how efficiently the chips can be cooled, leading to damage or premature failure. 

This isn’t really a new idea. Glass is just silicon dioxide, and it’s already the passivation layer in a lot of ICs. Likewise using it as the ’substrate‘ isn’t new, nor is using a ceramic like aluminium oxide.  This article is really talking about nothing. Short answer: they want to replace PCBs (what they refer to as organic substrates) with glass. Maybe someone wants to disagree, but when you are talking about a substrate for silicone manufacturing it is not the PCB that’s being referred to it’s whatever material the silicon is deposited on (usually aluminium oxide, silicone nitride or silicon oxide(s) ).  All of these are ceramics and have the same issues.  The silicon is soldered/braised or wired bonded to the PCB after is made, there are no organics involved (usually).

I would guess there is some reason to use glass instead of a standard PCB when dealing with connecting multiple chiplets (fast signals don’t like the traces getting longer due to thermal expansion), but it’s not really mentioned in this article.